- Package / Case :
5 产品
图片 | 型号 | 价格 | 数量 | 库存 | 制造商 | 描述 | Mounting Style | Package / Case | Maximum Operating Temperature | Packaging | Operating Supply Voltage | Operating Supply Current | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
获得报价 |
10
有现货
|
Maxim Integrated | Telecom Interface ICs Single TDM-Over-Pack Transport Device | SMD/SMT | TECSBGA-256 | + 85 C | Tube | 1.8 V, 3.3 V | 50 mA, 225 mA | |||
|
获得报价 |
13
有现货
|
Maxim Integrated | Telecom Interface ICs Dual TDM-Over-Pack Transport Device | SMD/SMT | TE-CSBGA-256 | + 85 C | Tube | 1.8 V, 3.3 V | 50 mA, 225 mA | |||
|
查看 | Maxim Integrated | Telecom Interface ICs Octal TDM-Over-Pack Transport Device | SMD/SMT | HSBGA-484 | + 85 C | Tube | 1.8 V, 3.3 V | 50 mA, 225 mA | ||||
|
获得报价 |
470
有现货
|
Maxim Integrated | Telecom Interface ICs Quad TDM-Over-Pack Transport Device | SMD/SMT | csBGA-256 | + 85 C | Tube | 1.8 V, 3.3 V | 50 mA, 225 mA | |||
|
查看 | Maxim Integrated | Telecom Interface ICs Octal TDM-Over-Pack Transport Device | SMD/SMT | HSBGA-484 | + 85 C | Tube | 1.8 V, 3.3 V | 50 mA, 225 mA |