- Part Status :
3 产品
| 图片 | 型号 | 价格 | 数量 | 库存 | 制造商 | 描述 | Package / Case | Series | Packaging | Number of Circuits | Function | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Interface | |
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查看 | Maxim Integrated | IC TDM/PACKET TRANSPORT 676BGA | 676-BGA | - | Tray | 1 | TDM-over-Packet (TDMoP) | Surface Mount | -40°C ~ 85°C | Discontinued at Digi-Key | 1.8V, 3.3V | 676-TEPBGA (27x27) | TDMoP | |||
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查看 | Maxim Integrated | IC TDM PACKET 32PORT 676PBGA | 676-BGA | - | Tray | 1 | TDM-over-Packet (TDMoP) | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V, 3.3V | 676-TEPBGA (27x27) | TDMoP | |||
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获得报价 |
53
有现货
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Maxim Integrated | IC TDM OVER PACKET 676-BGA | 676-BGA | - | Tray | 1 | TDM-over-Packet (TDMoP) | Surface Mount | -40°C ~ 85°C | Active | 1.8V, 3.3V | 676-TEPBGA (27x27) | TDMoP |
