- Contact Material :
- Row Spacing :
- Termination :
- Insulation Material :
3 产品
| 图片 | 型号 | 价格 | 数量 | 库存 | 制造商 | 描述 | Series | Packaging | Current Rating | Number of Positions | Number of Rows | Contact Material | Row Spacing | Connector Type | Mounting Type | Contact Type | Features | Style | Termination | Insulation Material | Description | |
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查看 | TE Connectivity AMP Connectors | 30/34 MODII 2PC HDR DR MFBL | AMPMODU MOD II | Bulk | - | 30 | 2 | Copper Alloy | 0.100" (2.54mm) | Header | Through Hole | Male Pin | Guide Pin | Board to Board or Cable | Press-Fit, Solder | Polyamide (PA), Nylon, Glass Filled | 30/34 MODII 2PC HDR DR MFBL | |||
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查看 | Molex, LLC | 2.0 WTB DUAL PLG HSG 32CKT | MicroClasp 5000637 | Tray | - | 30 | 2 | Brass | 0.197" (5.00mm) | Header | Through Hole | Male Pin | - | Board to Cable/Wire | Solder | Polybutylene Terephthalate (PBT), Glass Filled | 2.0 WTB DUAL PLG HSG 32CKT | |||
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查看 | Amphenol FCI | BERGSTIK II SNGL POL ST | BERGSTIK II | Bulk | - | 30 | 1 | Phosphor Bronze | - | Header | Through Hole | Male Pin | - | Board to Board | Solder | - | BERGSTIK II SNGL POL ST |
